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The Modules offered during
August - September 2010 are:
Contact and Fee Details
About Proficiency Courses
M. S. Ramaiah School of
Advanced Studies is offering an educational programme in the evening for the benefit of
students of Engineering,
AMIE and working engineers/managers through Continuing
Professional Development Cell.
Purpose
To create an opportunity for Students and Working
Professionals to update their knowledge in modern and thrust areas.
Who can take part?
Students of Science, Engineering and Management
Teachers of Science and Engineering
Practicing Engineers and Managers
Who deliver the Programme?
Faculty of MSRSAS
Faculty from Reputed Institutions
Practicing Scientists and Engineers
Delivery Methodology
Course notes will be given in slide
form
Will be taught using Audio Visuals
Includes demos and hands on
Help to add value to your career
3 hrs Session/day (Alternate days)
Duration of the course: 10days to 2 Weeks
Certification
MSRSAS awards a Certificate of ParticipationCourse Offering
Courses are offered every month
At a time maximum of 10 courses will be offered from a repository of 150
modules
A module will be repeated once in a year
A module is offered for minimum participants strength of 5
If the delegates are interested in a specific module, they can interact
with the School to offer the same as corporate
training programme
Course Offering Areas
- Automotive Engineering
- Automotive Product Design
- Automotive Electronics
- Advanced Manufacturing Technologies
- Advanced Medical Electronics
- Computer Animation and Games Development
- Computer Science and Networking
- Engineering & Manufacturing Management
- Electronics Systems Engineering
- Machinery Design
- Product Design
- Real Time Embedded Systems
- Rotating Machinery Design
- Signal Processing and Communication Technologies
- Strategic Product Design Management
- VLSI System Design
- MBA in Engineering Operations
- MBA in Finance and Accounting
- MBA in Human Resource Management
Forth Coming Weekend Programme
Commencing from 21st August 2010
Last Date for Registration : 19th
August
2010
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Module 1: Supply Chain
Management |
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Contents |
Tools |
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Supply Chain Management (SCM)
- History, Definition, Nature and importance of SCM, Current
trends in SCM, Value of information
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Supply Chain Concepts -
Flows of Material, Money and Information, Value Chain, Strategic
sourcing
Push and Pull Scheduling - Matching supply and demand, Collaborative
planning forecasting and replenishment(CPFR) technique, Aggregate
planning, Push and Pull strategy, and Drivers
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Manufacturing Logistics -
Inbound and Outbound logistics, Reverse logistics, Key factors in
optimising logistics, Role of logistics manager in strategic
decision and strategies
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Scope of Supply Chain
Management - Activities/Functions of SCM, Strategic fit supply
chain
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Make or Buy Strategy -
Supply chain strategy, Corporate mission and strategy, Current
trends and challenges, Make or buy choice, Quo and Decisions
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Outsourcing, Purchasing
Management and Partnership Sourcing - Managing supplier
relationship, Outsourcing, Purchasing process, Purchasing
strategies, Partnership sourcing, International Purchasing/Global
sourcing, Supply contracts
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E-Commerce, e-Business -
Overview, E-commerce and supply chain, E-business and e-commerce,
Stakeholders and major players, E-business framework, Development of
enterprise resource planning (ERP) Systems
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Linking SCM to other
Disciplines/Modules - Value chain, SC problems, Global supply
chain, Managerial issues in supply chain
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Designing the Supply Chain
Network - Roles and Factors influencing distribution network
design, Frameworks, Planning & managing inventories and
transportation, Role of IT and Coordination a supply chain
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Demos On:
SAP ERP and Quantative Modeling |
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By: Dr. K. Gnanamurthy, Professor & Head / K. M. Sharath Kumar,
Sr. Lecturer
Dept of Management Studies, MSRSAS
Start Date:
21st August 2010 End Date: 12th
September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 2:
Rotor Dynamics and Vibration of Machinery |
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Contents |
Tools |
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Vibration of Machinery:
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Overview of vibration in rotating
machine design.
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Analytical modelling and solution
for vibration:
i. Single DOF systems:
Free vibration: Undamped and viscously damped cases,
MATLAB solutions.
Forced vibration: Impulse and Fourier excitation,
response spectra, and modal frequency response,
MATLAB solutions.
ii. Two DOF systems, including coverage of the same topics listed
for one degree-of-freedom system,
MATLAB solutions.
iii. General multi-DOF systems, including: stiffness, flexibility
and mass
matrices; natural frequencies and mode shapes (eigenvalues and
eigenvectors), coupled modes, introduction to finite element
analysis,
MATLAB solutions.
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Energy methods, Lagrange's
equations, application to rotor- shaft systems.
i. Branched gear- shaft systems, rigid body modes; MATLAB solutions.
ii. Continuous (distributed parameter) systems, MATLAB and NASTRAN
solutions.
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Vibration testing: principles,
instrumentation, categories, test demonstrations.
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Rotor Dynamics;
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Imbalance characterisation in
Turbomachinery: Rigid- rotors: single-, and multi-plane balancing;
Flexible rotors, MATLAB solutions.
1) Critical Speeds and Response to Imbalance: Classical whirl,
analogy to buckling, MATLAB solutions.
2) Coriolis effects: Euler angles, Coriolis matrix, quadratic
eigenvalue problem solution, Campbell
diagrams, MATLAB solutions.
3) Bearings and Seals: Principles and analytical models.
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Demos On:
Vibration in systems |
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By: Dr. B. V.
Vijay, Professor - Dept of MME, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 3: Embedded DSP |
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Contents |
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Introduction to Embedded DSP
- Need of digital processing, Definition of a real-time DSP system,
Use of digital signal processors, Overview of typical DSP
algorithms, Parameters to consider for choosing DSP processors,
Programmable versus ASIC DSP and Overview of TMS & ADSP Blackfin
family processors
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Introduction to Software IDE
and Labview - Features of IDE, Debugging tools, Software build
process, Software development flow, Explanation of Linker
Description File (LDF), Programming Blackfin processors in C,
Creating efficient C code, Case study examples, Introduction to
Labview and Architectural overview of Labview embedded for embedded
processors
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Time-Domain Signals and
Systems - Time-domain digital signals, Sinusoidal signals,
Random signals, Introduction to digital systems, Moving-average
filters, Structures & equations, Digital filters, Realization of FIR
filters, Nonlinear filters and Hands-on experiments using MATLAB &
embedded processors
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Frequency-Domain Analysis and
Processing - The z-transform, System concepts, Digital filters,
Frequency analysis, Frequency response, Discrete Fourier transform,
Fast Fourier transform, Window functions, Simple low-pass filters,
Notch filters, Peak filters and Hands-on experiments using MATLAB &
embedded processors
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Digital Filtering - Ideal
filters, Practical filter specifications, Finite impulse response
filters,Characteristics & implementation of FIR filters, Design of
FIR filters, Infinite impulse response filters, Design of IIR
filters, Structures & characteristics of IIR filters, Adaptive
filters, Structures & algorithms of adaptive filters, Design &
applications of adaptive filters and Case study
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Introduction to the Embedded
Processor, Blackfin Processor Architecture - Architecture for
embedded media processor, Introduction to micro signal architecture,
Hardware processing units, Register files, Bus architecture, Memory,
Basic peripherals of embedded processor, Software tools for the
processor, Software development flow & tools, Assembly programming,
Debugging features and Case study
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Real-Time DSP Fundamentals and
Implementation Considerations - Number formats used in the
embedded processor, Fixed-point formats, Fixed-point extended
format, Fixed-point data types, Emulation of floating-point format,
Block floating-point format, Dynamic range, Precision, Quantization
errors, Dynamic range, Signal-to-quantization noise ratio,
Precision, Sources of quantization errors in digital systems,
Overview of real-time processing, Real-time versus offline
processing, Sample-by-sample processing mode & its real-time
constraints, Block processing mode & its real-time constraints,
Performance parameters for real-time implementation and Case study
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Memory System and Data
Transfer - Overview of signal acquisition & transfer to memory,
Understanding the CODEC, Understanding the serial port, DMA
operations & programming, DMA transfer configuration, Setting up the
auto buffer-mode DMA, Memory DMA transfer, Setting up memory DMA,
Examples of using memory DMA, Advanced features of DMA, Cache memory
concepts, Terminology in cache memory, Instruction cache, Data
cache, Memory management unit and Comparing & choosing between cache
& memory DMA
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Code Optimization and Power
Management- Code optimization, C-optimization techniques, C
compiler, C programming considerations, Intrinsic library, Inlining
library, C/C run time library, DSP run time library,
Profile-guided optimization, Using assembly code for efficient
programming, Using hardware loops, Using dual MACs, Using parallel
instructions, Special addressing modes, Separate data sections,
Using software pipelining, Power consumption & management in the
embedded processor, Computing system power and Power management in
the embedded processor
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Multimedia - Introduction
to multimedia, Benefits of multimedia, Examples of
multimediaapplications, Introduction to audio and video, Overview of
audio and video compression, Streaming stored audio/video, Streaming
live audio/video and Multimedia protocols such as RTP,
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RTCP, VOIP & SIP
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Basics of Embedded Audio
Processing - Audio signals, Speech processing, Audio sources &
sinks, Converting between analog & digital audio signals, Background
on audio converters, Audio ADCs, Audio DACs, Connecting to audio
converters, Audio protocols such as I2S (Inter-ICSound) & SPI
(Serial Peripheral Interface), DACs, Codecs, AC '97, Speech codecs,
PWM output, Interconnections, Audio compression standards such as
MP3, AAC, AC-3, WMA, RealAudio, Vorbis, FLAC, Speech compression,
“G-Dot” Standards such as G.711, G.723.1, G.729 & Speex and Case
study
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Basics of Embedded Video and
Image Processing - Human visual perception, Video signals,
Broadcast TV, Video resolution, Interlaced versus progressive
scanning, Colour spaces, Gamma correction, Chroma sub sampling,
Digital video, ITU-R BT.601, ITU-R BT.656, Video sources, Video
displays, Compression, Decompression, Lossless versus lossy
compression, Image compression, Formats of image such as BMP, GIF,
PNG, JPEG, and JPEG2000, Video compression, Video standards such as
Motion JPEG (M-JPEG), H.261, MPEG-1, MPEG-2,H.263, MPEG-4, DV,
QuickTime, Real Video, Windows Media Video (WMV)/VC-1, Theora, H.264
and Case Study
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Demos On:
DSP processor IDE, Labview |
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By: Mr. S. G. Shiva Prasad Yadav, Sr. Lecturer, Dept of ECE, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 4: Fiber Optic
Communication |
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Contents |
Tools |
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Optical sources, Wave Guides
- Light Emitting Diodes - LED structures - surface and edge
emitters, internal quantum efficiency - Injection Laser Diodes
structures - comparison of LED and ILD.
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Optical Detectors, Optical
amplifiers - The PN junction photo diode - PIN photo detectors -
Avalanche photo diode construction characteristics and properties -
comparison of performance noise sources, Semiconductor optical
amplifiers, Erbium doped optical amplifiers
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Optical fiber types, Losses
- Rays and modes - step index fiber structure - Ray optics
representation - wave representation - grade index fiber structure -
GI numerical aperture, Fiber material and their Fabrication methods,
specifications of cables. Attenuation absorption, scattering and
radiation losses - signal distortions - intra model and inter model
distortions, material and wave guide distortions.
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Optical Fibers - Types of
cables, Design principle, Connectors and Splicers, Measurement of
OTDR,
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System Design parameters using
software tools - Modulation techniques, Modulators, De
modulators, design of Analog and digital optical fiber communication
systems
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Design and analysis of Point
to point links - Transmission Link Analysis, system
consideration - Link power budget - rise time budget - transmission
distance version bit rate - data buses - star configuration and
coupler data buses.
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Introduction to optical
networks - Optical-communication infrastructure, The Emergence
of the Optical Network, Overview of the All-Optical Network,
Components of the All-Optical Networks Multiplexers/Demultiplexers,
Routers, and Cross-Connects, wavelength routed networks, optical
Switches
Transmission standard protocols & Fault Management - PDH, SDH, SONET,
STS, STM, OC, Protection concepts, fault protection detection and
correction, Homing, optical safety
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Broadcast and select networks
- WDM / DWDM networks, algorithms for optical network design,
optical CDMA, Technological issues leading to development of optical
networks
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Demos On:
Soft TDM, Matlab |
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By:
Mr. Ugra Mohan Roy, Sr. Lecturer, Dept. Of ECE, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 5:
High Speed Board Design |
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Contents |
Tools |
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Introduction to High Speed
Board Design: PCB Design Environment, Challenges in Modern PCBs,
Hardware Development Cycle Phases, PCB Design Considerations, Major
types of PCBs, PCB Design Process
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Fundamentals of High Speed
Design : Frequency, Time and Distance, Lumped Versus Distributed
Systems, Four Kinds of Reactance, Ordinary and Mutual Capacitance &
Inductance
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Printed Circuit Board Design:
What is PCB, Parts of PCB, Component, pads, via, top layer, bottom
layer, silk screen, multilayer PCB, Inductive Coupling, Capacitive
coupling, Steps in PCB Design, Physical design Issue.
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Transmission Lines: Basic
definitions, Electromagnetic Signal, Time and Frequency domain
concepts, Transmission Lines, Microstrip, Stripline, Odd and Even
Transmission Line, How to use Transmission Lines, Decoupling Caps,
Ground/Power Bounce, Electrostatic Discharge (ESD).
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Crosstalk in High Speed Board:
What is Crosstalk, Crosstalk Induced Noise, Effect of crosstalk
on transmission line parameters, Crosstalk Trends, Design Guidelines
and Rules of Thumb
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Signal Integrity: What is
signal integrity, Effect of Signal Integrity on Transmission Line,
Effect of Crosstalk, Termination, reflection and field solver,
Analysis of Signal Integrity, Modeling and Simulation.
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Routing of High Speed Signal:
Main issues for routing, Routing topologies, Rise and fall time
degradation, Signal Skew, Line Termination, Power distribution and
de-coupling, PCB Stackup, Return Path Discontinuities.
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EMC, EMC and High Speed Design,
Electro Magnetic Interference, Natural and Nuclear Sources of EMI,
Conducted Emissions and Susceptibility, Test and Measurement of EMI,
EMC standards
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High Speed Board Design for
EMI/EMC Compliances: Definitions, PC Board Materials &
Construction, EMC Fundamentals, EMI Suppression, Signal Integrity,
Bypassing & Decoupling, Trace Routing, ESD Protection.
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PCB Materials & Fabrication
Process: Materials used in FPCB, Direct Materials, Indirect
Materials, Manufacturing Processes for a Multi-layer PCB, Inner
Layer Processing Material Selection, Laminating and Imaging of
Internal Layers, Etch Process, Remove Laminating Film, Completed
Inner Layer Core, Layer stackup, Bonding Heat, Electro-plating
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Case Study on : Design &
Development of 1) Multi Gigabit transmission 2) FPGA based DUC/DDC
board for power line communication.
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Demos On:
Cadence Allegro SPB 16. 2, OrCad 16.2 , HSPICE |
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By:
Mr. Martin T.J, Sr. Lecturer- Dept. of ECE , MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 6: Real Time
Systems |
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Contents |
Tools |
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Introduction to Real Time
Systems - Introduction, Real time Applications, Real time
Terminology, Elements of a real time Embedded system, Hard and soft
real time systems, Real time, terminology, Real time system
components, Issues related to real time systems, Attributes of real
time systems, Real time System development
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Reference Model of Real Time
Systems - Concept of workload model and scheduling model,
Periodic Task Model Feasible Scheduling , Scheduling methods,
Pre-emptive and non pre-emptive types, Key concepts in Real-Time
Computing
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General Purpose Operating
Systems- Introduction to General Purpose Operating System,
Operating System requirement, works performed by the Operating
System, multitasking, scheduler, dispatcher, various mechanisms for
IPC's, Comparison of some common operating systems
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Real time operating Systems -
Introduction to RTOS, Need for RTOS in Embedded Applications,
Difference between general purpose and Real time Operating System,
RTOS Responsibilities, Monolithic Kernel Versus Micro-Kernel,
Characteristic Features of Real-Time Operating System (RTOS), List
of RTOS
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Multitasking - Need for
Multitasking in a real time system, Unitask approach and Multitask
approach, Multitasking Kernel, Kernel Function, Context Switch,
Priority Scheduling, Priority Based Pre-emption, Round-Robin
Scheduling, Kernel Time Slicing, Demo on Multitasking and its
features using suitable software
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Inter Process communication -
Need for Intertask communication and its components, Shared Memory,
Message Queues, Pipes, Semaphores, Task synchronization and Mutual
Exclusion.
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OSEK RTOS - Introduction
to OSEK Standards, OSEK Implementation Language, Task Model, Basic
Tasks and Extended Tasks, Conformance Classes, Scheduling Policies,
Alarms, Counters, Alarm Services, OSEK Events, Resources, Interrupt
Processing, ISRs, Interprocess Communication, Communication
Services, Communication Model, Network Management, Case Study.
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Demos On:
Cadence OSEK TURBO, FREE OSEK |
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By:
Ms. B. Ramya, Sr. Lecturer, Dept of ECE, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 7: Structural
Fatigue and Reliability Analysis |
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Contents |
Tools |
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Introduction and Overview of
Fatigue - Introduction, History, Fundamental concepts,
Strategies in fatigue design, Fatigue design criteria, Macro/Micro
aspects of metal fatigue, Fatigue analysis, Fatigue life prediction
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Fatigue analysis Stress-life
approach - Introduction, S-N Curve, Endurance limit,
Modification factors, Stress-life approach to fatigue life
prediction
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Fatigue analysis Strain-life
approach - Introduction, Strain-life approach, Response of
material to cyclic loading, cyclic stress-strain relationship,
Strain-life behaviour, Strain-life equation, Mean stress effect.
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Fatigue Crack Growth Laws
- Introduction and Overview of Fracture mechanics, Fracture
mechanics design approach, Brittle and Ductile fracture, Linear
Elastic Fracture Mechanics (LEFM), The energy release rate (G),
Instability and R-curve, Stress analysis of cracks, The stress
intensity factor (SIF), Crack Tip Plasticity and Elastic Plastic
Fracture Mechanics (EPFM), Different models of Crack-tip plasticity,
CTOD, J-Integral, Fatigue crack growth, Fatigue crack growth laws.
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Variable Amplitude Loading and
FCG - Variable loading, Multi-axial fatigue, Experimental
measurement of fatigue crack growth, Designing against fracture,
Damage Tolerance design methodology.
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Reliability Analysis and
Fatigue Design - Concept of safety, Risk and reliability, Risk
analysis, As Low As Reasonably Practicable (ALARP) criteria,
Principles and best practice, Top-down approach in risk and
reliability analysis. Bottom-up approach in risk and reliability
analysis, Probabilistic risk and reliability analysis techniques
(PRA), Non-probabilistic risk and reliability analysis techniques
(non-PRA)
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Demos On:
ANSYS,
fe-safe |
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By:
Mr. Chidambar D Kulkarni, Sr. Training Engineer , Dept. of ADE, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 8: Automotive
Interior Design |
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Contents |
Tools |
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Interior styling - Design
concept, sketching and modelling of interiors, fit and finish of
interiors, quality of interiors, blending of colours for different
interior components, roof lining, positioning of various lamping
devices, door pad design, gear knob design for better feel, carpet
design.
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Ergonomics and Packaging -
Importance of ergonomics in vehicle interior design, interior
ergonomics of a car, trends in aesthetics and ergonomics,
positioning of different components and their interface, ergonomics
methods and tools to promote occupant accommodation, case studies,
future trends, strategies for improving occupant accommodation and
comfort, accommodation for airbags, steering column developments.
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Seating - Different types
of seats, structural and dimensional factors in seating, measuring
seat comfort, configurable armrests, child seat, fabrics for seats
and its significance for thermal comfort, whiplash innovations, new
interior trends, tomorrow's interiors. dummy leg pad.
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Entertainment and multimedia
systems - Importance of personal entertainment systems and
positioning of output devices.
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Driver Assist - Night
vision, head-up displays, implication of controls, touch pads for
drivers, voice recognition, Console developments and innovations,
modular cockpits, dashboard instruments, advances in electronic
displays.
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Materials - Environmental
friendly plastics and other materials for interior design, use of
recycling materials for interior design.
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Occupant comfort - The
quest for clean air, air conditioning developments, climate control,
air quality, filter rate, re-circulated conditioned air inside
cabin.
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Acoustics - Acoustics
inside the vehicle, noise reduction techniques, simulations, case
studies.
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Demos On:
LMS Virtual Lab |
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By:
Mr. Manas Ranjan Mishra , Asst. Professor, Dept. of Design, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Module 9: Design for Manufacture and
Assembly |
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Contents |
Tools |
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Concurrent Engineering DFMA
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Design for Manual Assembly
(Manual method)
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Computer Assisted Design for
Manual Assembly
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Quick Costing Techniques and use
of Boothroyd Dewhurst Inc Software
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Design for Automatic Assembly
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Mechanical Fastening Developments
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Use of Adhesives in Manufacturing
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Designing for injection Moulding,
die Casting, Press work
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Product Design for the
Environment (Recycling and Remanufacture)
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Design for Servicing and
Maintainability
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Demos On:
Design for Manufacturability and Assembly Boothroyd Dewhurst Inc |
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By:
Prof.
M. N. Sudhindra Kumar , Professor, Dept. Of Design, MSRSAS
Start Date:
21st August 2010 End Date:
12th September 2010
Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm |
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Contact and Fee Details :
Course Fee:
Theory : Rs.
5,000/-
Theory and Laboratory: Rs. 10,000/- payable as a single installment.
You can pay the Course Fee
by Cash on the course joining day or
enroll yourself by sending a Cheque/DD in advance in favour of
M. S. Ramaiah School of Advanced
Studies, Bangalore.
Kindly bring two passport/stamp
size photos for registration purpose.
For further enquiries or clarifications, please
contact
Mr. Vijaykumar S.
Manager - Academic Relations
E-Mail: vijaykumar@msrsas.org, vijay.msrsas@gmail.com
Mobile: 998863 94532
Mrs. Roopa
Executive - Academic Relations
E-Mail: roopa@msrsas.org
Mobile: 96630 63832
Phone: Direct: 4167 4719, (080) 2360 5539, 2360 1983, 2360 4759 Fax: 80 - 2360 1923
Note:
If you are unable to attend the course due to time constraints then
the same course can be conducted as a corporate training
programme
provided the participants strength is 15 or above. So please feel
free to contact us for any other information. |
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