Proficiency Programme Batch-77

 

The Modules offered during August - September 2010 are:

Contact and Fee Details

About Proficiency Courses

M. S. Ramaiah School of Advanced Studies is offering an educational programme in the evening for the benefit of students of Engineering,
AMIE and working engineers/managers through Continuing Professional Development Cell.

Purpose

To create an opportunity for Students and Working Professionals to update their knowledge in modern and thrust areas.

Who can take part?

Students of Science, Engineering and Management
Teachers of Science and Engineering
Practicing Engineers and Managers

Who deliver the Programme?

Faculty of MSRSAS
Faculty from Reputed Institutions
Practicing Scientists and Engineers

Delivery Methodology

Course notes will be given in slide form
Will be taught using Audio Visuals
Includes demos and hands on
Help to add value to your career
3 hrs Session/day (Alternate days)
Duration of the course: 10days to 2 Weeks

Certification

MSRSAS awards a Certificate of Participation

Course Offering

Courses are offered every month
At a time maximum of 10 courses will be offered from a repository of 150 modules
A module will be repeated once in a year
A module is offered for minimum participants strength of 5
If the delegates are interested in a specific module, they can interact with the School to offer the same as corporate
training programme

Course Offering Areas

  1. Automotive Engineering
  2. Automotive Product Design
  3. Automotive Electronics
  4. Advanced Manufacturing Technologies
  5. Advanced Medical Electronics
  6. Computer Animation and Games Development
  7. Computer Science and Networking
  8. Engineering & Manufacturing Management
  9. Electronics Systems Engineering
  10. Machinery Design
  11. Product Design
  12. Real Time Embedded Systems
  13. Rotating Machinery Design
  14. Signal Processing and Communication Technologies
  15. Strategic Product Design Management
  16. VLSI System Design
  17. MBA in Engineering Operations
  18. MBA in Finance and Accounting
  19. MBA in Human Resource Management

Forth Coming Weekend Programme Commencing from 21st August 2010

Last Date for Registration : 19th August 2010

Module 1: Supply Chain Management

 

Contents

Tools

  • Supply Chain Management (SCM) - History, Definition, Nature and importance of SCM, Current trends in SCM, Value of information

  • Supply Chain Concepts - Flows of Material, Money and Information, Value Chain, Strategic sourcing
    Push and Pull Scheduling - Matching supply and demand, Collaborative planning forecasting and replenishment(CPFR) technique, Aggregate planning, Push and Pull strategy, and Drivers

  • Manufacturing Logistics - Inbound and Outbound logistics, Reverse logistics, Key factors in optimising logistics, Role of logistics manager in strategic decision and strategies

  • Scope of Supply Chain Management - Activities/Functions of SCM, Strategic fit supply chain

  • Make or Buy Strategy - Supply chain strategy, Corporate mission and strategy, Current trends and challenges, Make or buy choice, Quo and Decisions

  • Outsourcing, Purchasing Management and Partnership Sourcing - Managing supplier relationship, Outsourcing, Purchasing process, Purchasing strategies, Partnership sourcing, International Purchasing/Global sourcing, Supply contracts

  • E-Commerce, e-Business - Overview, E-commerce and supply chain, E-business and e-commerce, Stakeholders and major players, E-business framework, Development of enterprise resource planning (ERP) Systems

  • Linking SCM to other Disciplines/Modules - Value chain, SC problems, Global supply chain, Managerial issues in supply chain

  • Designing the Supply Chain Network - Roles and Factors influencing distribution network design, Frameworks, Planning & managing inventories and transportation, Role of IT and Coordination a supply chain

 

 

 

 

Demos On:
SAP ERP and Quantative Modeling

By:  Dr. K. Gnanamurthy, Professor & Head / K. M. Sharath Kumar, Sr. Lecturer
       Dept of Management Studies, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm


    

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Module 2: Rotor Dynamics and Vibration of Machinery

 

Contents

Tools

  • Vibration of Machinery:

  • Overview of vibration in rotating machine design.

  • Analytical modelling and solution for vibration:
    i. Single DOF systems:
         Free vibration: Undamped and viscously damped cases, MATLAB solutions.
         Forced vibration: Impulse and Fourier excitation, response spectra, and modal frequency response,
         MATLAB solutions.
    ii. Two DOF systems, including coverage of the same topics listed for one degree-of-freedom system,
        MATLAB solutions.
    iii. General multi-DOF systems, including: stiffness, flexibility and mass
    matrices; natural frequencies and mode shapes (eigenvalues and
    eigenvectors), coupled modes, introduction to finite element analysis,
    MATLAB solutions.

  • Energy methods, Lagrange's equations, application to rotor- shaft systems.
    i. Branched gear- shaft systems, rigid body modes; MATLAB solutions.
    ii. Continuous (distributed parameter) systems, MATLAB and NASTRAN solutions.

  • Vibration testing: principles, instrumentation, categories, test demonstrations.

  • Rotor Dynamics;

  • Imbalance characterisation in Turbomachinery: Rigid- rotors: single-, and multi-plane balancing; Flexible rotors, MATLAB solutions.
    1) Critical Speeds and Response to Imbalance: Classical whirl, analogy to buckling, MATLAB solutions.
    2) Coriolis effects: Euler angles, Coriolis matrix, quadratic eigenvalue problem solution, Campbell
        diagrams, MATLAB solutions.
    3) Bearings and Seals: Principles and analytical models.

 

 

 

 

Demos On: Vibration in systems

By: Dr. B. V. Vijay, Professor - Dept of MME, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm 


    

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Module 3: Embedded DSP

 

Contents

 
  •  Introduction to Embedded DSP - Need of digital processing, Definition of a real-time DSP system, Use of digital signal processors, Overview of typical DSP algorithms, Parameters to consider for choosing DSP processors, Programmable versus ASIC DSP and Overview of TMS & ADSP Blackfin family processors

  • Introduction to Software IDE and Labview - Features of IDE, Debugging tools, Software build process, Software development flow, Explanation of Linker Description File (LDF), Programming Blackfin processors in C, Creating efficient C code, Case study examples, Introduction to Labview and Architectural overview of Labview embedded for embedded processors

  • Time-Domain Signals and Systems - Time-domain digital signals, Sinusoidal signals, Random signals, Introduction to digital systems, Moving-average filters, Structures & equations, Digital filters, Realization of FIR filters, Nonlinear filters and Hands-on experiments using MATLAB & embedded processors

  • Frequency-Domain Analysis and Processing - The z-transform, System concepts, Digital filters, Frequency analysis, Frequency response, Discrete Fourier transform, Fast Fourier transform, Window functions, Simple low-pass filters, Notch filters, Peak filters and Hands-on experiments using MATLAB & embedded processors

  • Digital Filtering - Ideal filters, Practical filter specifications, Finite impulse response filters,Characteristics & implementation of FIR filters, Design of FIR filters, Infinite impulse response filters, Design of IIR filters, Structures & characteristics of IIR filters, Adaptive filters, Structures & algorithms of adaptive filters, Design & applications of adaptive filters and Case study

  • Introduction to the Embedded Processor, Blackfin Processor Architecture - Architecture for embedded media processor, Introduction to micro signal architecture, Hardware processing units, Register files, Bus architecture, Memory, Basic peripherals of embedded processor, Software tools for the processor, Software development flow & tools, Assembly programming, Debugging features and Case study

  • Real-Time DSP Fundamentals and Implementation Considerations - Number formats used in the embedded processor, Fixed-point formats, Fixed-point extended format, Fixed-point data types, Emulation of floating-point format, Block floating-point format, Dynamic range, Precision, Quantization errors, Dynamic range, Signal-to-quantization noise ratio, Precision, Sources of quantization errors in digital systems, Overview of real-time processing, Real-time versus offline processing, Sample-by-sample processing mode & its real-time constraints, Block processing mode & its real-time constraints, Performance parameters for real-time implementation and Case study

  • Memory System and Data Transfer - Overview of signal acquisition & transfer to memory, Understanding the CODEC, Understanding the serial port, DMA operations & programming, DMA transfer configuration, Setting up the auto buffer-mode DMA, Memory DMA transfer, Setting up memory DMA, Examples of using memory DMA, Advanced features of DMA, Cache memory concepts, Terminology in cache memory, Instruction cache, Data cache, Memory management unit and Comparing & choosing between cache & memory DMA

  • Code Optimization and Power Management- Code optimization, C-optimization techniques, C compiler, C programming considerations, Intrinsic library, Inlining library, C/C run time library, DSP run time library, Profile-guided optimization, Using assembly code for efficient programming, Using hardware loops, Using dual MACs, Using parallel instructions, Special addressing modes, Separate data sections, Using software pipelining, Power consumption & management in the embedded processor, Computing system power and Power management in the embedded processor

  • Multimedia - Introduction to multimedia, Benefits of multimedia, Examples of multimediaapplications, Introduction to audio and video, Overview of audio and video compression, Streaming stored audio/video, Streaming live audio/video and Multimedia protocols such as RTP,

  • RTCP, VOIP & SIP

  • Basics of Embedded Audio Processing - Audio signals, Speech processing, Audio sources & sinks, Converting between analog & digital audio signals, Background on audio converters, Audio ADCs, Audio DACs, Connecting to audio converters, Audio protocols such as I2S (Inter-ICSound) & SPI (Serial Peripheral Interface), DACs, Codecs, AC '97, Speech codecs, PWM output, Interconnections, Audio compression standards such as MP3, AAC, AC-3, WMA, RealAudio, Vorbis, FLAC, Speech compression, “G-Dot” Standards such as G.711, G.723.1, G.729 & Speex and Case study

  • Basics of Embedded Video and Image Processing - Human visual perception, Video signals, Broadcast TV, Video resolution, Interlaced versus progressive scanning, Colour spaces, Gamma correction, Chroma sub sampling, Digital video, ITU-R BT.601, ITU-R BT.656, Video sources, Video displays, Compression, Decompression, Lossless versus lossy compression, Image compression, Formats of image such as BMP, GIF, PNG, JPEG, and JPEG2000, Video compression, Video standards such as Motion JPEG (M-JPEG), H.261, MPEG-1, MPEG-2,H.263, MPEG-4, DV, QuickTime, Real Video, Windows Media Video (WMV)/VC-1, Theora, H.264 and Case Study
     

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Demos On:
DSP processor IDE, Labview

By: Mr. S. G. Shiva Prasad Yadav, Sr. Lecturer, Dept of ECE, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 4: Fiber Optic Communication

 

Contents

Tools

  • Optical sources, Wave Guides - Light Emitting Diodes - LED structures - surface and edge emitters, internal quantum efficiency - Injection Laser Diodes structures - comparison of LED and ILD.

  • Optical Detectors, Optical amplifiers - The PN junction photo diode - PIN photo detectors - Avalanche photo diode construction characteristics and properties - comparison of performance noise sources, Semiconductor optical amplifiers, Erbium doped optical amplifiers

  • Optical fiber types, Losses - Rays and modes - step index fiber structure - Ray optics representation - wave representation - grade index fiber structure - GI numerical aperture, Fiber material and their Fabrication methods, specifications of cables. Attenuation absorption, scattering and radiation losses - signal distortions - intra model and inter model distortions, material and wave guide distortions.

  • Optical Fibers - Types of cables, Design principle, Connectors and Splicers, Measurement of OTDR,

  • System Design parameters using software tools - Modulation techniques, Modulators, De modulators, design of Analog and digital optical fiber communication systems

  • Design and analysis of Point to point links - Transmission Link Analysis, system consideration - Link power budget - rise time budget - transmission distance version bit rate - data buses - star configuration and coupler data buses.

  • Introduction to optical networks - Optical-communication infrastructure, The Emergence of the Optical Network, Overview of the All-Optical Network, Components of the All-Optical Networks Multiplexers/Demultiplexers, Routers, and Cross-Connects, wavelength routed networks, optical Switches
    Transmission standard protocols & Fault Management - PDH, SDH, SONET, STS, STM, OC, Protection concepts, fault protection detection and correction, Homing, optical safety

  • Broadcast and select networks - WDM / DWDM networks, algorithms for optical network design, optical CDMA, Technological issues leading to development of optical networks
     

 

 

 

 

Demos On:
 Soft TDM, Matlab

By:  Mr. Ugra Mohan Roy, Sr. Lecturer, Dept. Of ECE, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 5: High Speed Board Design

 

Contents

Tools

  • Introduction to High Speed Board Design: PCB Design Environment, Challenges in Modern PCBs, Hardware Development Cycle Phases, PCB Design Considerations, Major types of PCBs, PCB Design Process

  • Fundamentals of High Speed Design : Frequency, Time and Distance, Lumped Versus Distributed Systems, Four Kinds of Reactance, Ordinary and Mutual Capacitance & Inductance

  • Printed Circuit Board Design: What is PCB, Parts of PCB, Component, pads, via, top layer, bottom layer, silk screen, multilayer PCB, Inductive Coupling, Capacitive coupling, Steps in PCB Design, Physical design Issue.

  • Transmission Lines: Basic definitions, Electromagnetic Signal, Time and Frequency domain concepts, Transmission Lines, Microstrip, Stripline, Odd and Even Transmission Line, How to use Transmission Lines, Decoupling Caps, Ground/Power Bounce, Electrostatic Discharge (ESD).

  • Crosstalk in High Speed Board: What is Crosstalk, Crosstalk Induced Noise, Effect of crosstalk on transmission line parameters, Crosstalk Trends, Design Guidelines and Rules of Thumb

  • Signal Integrity: What is signal integrity, Effect of Signal Integrity on Transmission Line, Effect of Crosstalk, Termination, reflection and field solver, Analysis of Signal Integrity, Modeling and Simulation.

  • Routing of High Speed Signal: Main issues for routing, Routing topologies, Rise and fall time degradation, Signal Skew, Line Termination, Power distribution and de-coupling, PCB Stackup, Return Path Discontinuities.

  • EMC, EMC and High Speed Design, Electro Magnetic Interference, Natural and Nuclear Sources of EMI, Conducted Emissions and Susceptibility, Test and Measurement of EMI, EMC standards

  • High Speed Board Design for EMI/EMC Compliances: Definitions, PC Board Materials & Construction, EMC Fundamentals, EMI Suppression, Signal Integrity, Bypassing & Decoupling, Trace Routing, ESD Protection.

  • PCB Materials & Fabrication Process: Materials used in FPCB, Direct Materials, Indirect Materials, Manufacturing Processes for a Multi-layer PCB, Inner Layer Processing Material Selection, Laminating and Imaging of Internal Layers, Etch Process, Remove Laminating Film, Completed Inner Layer Core, Layer stackup, Bonding Heat, Electro-plating

  • Case Study on : Design & Development of 1) Multi Gigabit transmission 2) FPGA based DUC/DDC board for power line communication.
     

 

 

 

 

Demos On:
 Cadence Allegro SPB 16. 2, OrCad 16.2 , HSPICE

By:  Mr. Martin T.J, Sr. Lecturer- Dept. of ECE , MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 6: Real Time Systems

 

Contents

Tools

  • Introduction to Real Time Systems - Introduction, Real time Applications, Real time Terminology, Elements of a real time Embedded system, Hard and soft real time systems, Real time, terminology, Real time system components, Issues related to real time systems, Attributes of real time systems, Real time System development

  • Reference Model of Real Time Systems - Concept of workload model and scheduling model, Periodic Task Model Feasible Scheduling , Scheduling methods, Pre-emptive and non pre-emptive types, Key concepts in Real-Time Computing

  • General Purpose Operating Systems- Introduction to General Purpose Operating System, Operating System requirement, works performed by the Operating System, multitasking, scheduler, dispatcher, various mechanisms for IPC's, Comparison of some common operating systems

  • Real time operating Systems - Introduction to RTOS, Need for RTOS in Embedded Applications, Difference between general purpose and Real time Operating System, RTOS Responsibilities, Monolithic Kernel Versus Micro-Kernel, Characteristic Features of Real-Time Operating System (RTOS), List of RTOS

  • Multitasking - Need for Multitasking in a real time system, Unitask approach and Multitask approach, Multitasking Kernel, Kernel Function, Context Switch, Priority Scheduling, Priority Based Pre-emption, Round-Robin Scheduling, Kernel Time Slicing, Demo on Multitasking and its features using suitable software

  • Inter Process communication - Need for Intertask communication and its components, Shared Memory, Message Queues, Pipes, Semaphores, Task synchronization and Mutual Exclusion.

  • OSEK RTOS - Introduction to OSEK Standards, OSEK Implementation Language, Task Model, Basic Tasks and Extended Tasks, Conformance Classes, Scheduling Policies, Alarms, Counters, Alarm Services, OSEK Events, Resources, Interrupt Processing, ISRs, Interprocess Communication, Communication Services, Communication Model, Network Management, Case Study.
     

 

 

 

 

Demos On:
 Cadence OSEK TURBO, FREE OSEK

By:  Ms. B. Ramya, Sr. Lecturer, Dept of ECE, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 7: Structural Fatigue and Reliability Analysis

 

Contents

Tools

  • Introduction and Overview of Fatigue - Introduction, History, Fundamental concepts, Strategies in fatigue design, Fatigue design criteria, Macro/Micro aspects of metal fatigue, Fatigue analysis, Fatigue life prediction

  • Fatigue analysis Stress-life approach - Introduction, S-N Curve, Endurance limit, Modification factors, Stress-life approach to fatigue life prediction

  • Fatigue analysis Strain-life approach - Introduction, Strain-life approach, Response of material to cyclic loading, cyclic stress-strain relationship, Strain-life behaviour, Strain-life equation, Mean stress effect.

  • Fatigue Crack Growth Laws - Introduction and Overview of Fracture mechanics, Fracture mechanics design approach, Brittle and Ductile fracture, Linear Elastic Fracture Mechanics (LEFM), The energy release rate (G), Instability and R-curve, Stress analysis of cracks, The stress intensity factor (SIF), Crack Tip Plasticity and Elastic Plastic Fracture Mechanics (EPFM), Different models of Crack-tip plasticity, CTOD, J-Integral, Fatigue crack growth, Fatigue crack growth laws.

  • Variable Amplitude Loading and FCG - Variable loading, Multi-axial fatigue, Experimental measurement of fatigue crack growth, Designing against fracture, Damage Tolerance design methodology.

  • Reliability Analysis and Fatigue Design - Concept of safety, Risk and reliability, Risk analysis, As Low As Reasonably Practicable (ALARP) criteria, Principles and best practice, Top-down approach in risk and reliability analysis. Bottom-up approach in risk and reliability analysis, Probabilistic risk and reliability analysis techniques (PRA), Non-probabilistic risk and reliability analysis techniques (non-PRA)

 

 

 

 

Demos On:
 ANSYS,
fe-safe

By:   Mr. Chidambar D Kulkarni, Sr. Training Engineer , Dept. of ADE, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 8: Automotive Interior Design

 

Contents

Tools

  • Interior styling - Design concept, sketching and modelling of interiors, fit and finish of interiors, quality of interiors, blending of colours for different interior components, roof lining, positioning of various lamping devices, door pad design, gear knob design for better feel, carpet design.

  • Ergonomics and Packaging - Importance of ergonomics in vehicle interior design, interior ergonomics of a car, trends in aesthetics and ergonomics, positioning of different components and their interface, ergonomics methods and tools to promote occupant accommodation, case studies, future trends, strategies for improving occupant accommodation and comfort, accommodation for airbags, steering column developments.

  • Seating - Different types of seats, structural and dimensional factors in seating, measuring seat comfort, configurable armrests, child seat, fabrics for seats and its significance for thermal comfort, whiplash innovations, new interior trends, tomorrow's interiors. dummy leg pad.

  • Entertainment and multimedia systems - Importance of personal entertainment systems and positioning of output devices.

  • Driver Assist - Night vision, head-up displays, implication of controls, touch pads for drivers, voice recognition, Console developments and innovations, modular cockpits, dashboard instruments, advances in electronic displays.

  • Materials - Environmental friendly plastics and other materials for interior design, use of recycling materials for interior design.

  • Occupant comfort - The quest for clean air, air conditioning developments, climate control, air quality, filter rate, re-circulated conditioned air inside cabin.

  • Acoustics - Acoustics inside the vehicle, noise reduction techniques, simulations, case studies.

 

 

 

 

Demos On:
 LMS Virtual Lab

By:  Mr. Manas Ranjan Mishra , Asst. Professor, Dept. of Design, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Module 9: Design for Manufacture and Assembly

 

Contents

Tools

  • Concurrent Engineering DFMA

  • Design for Manual Assembly (Manual method)

  • Computer Assisted Design for Manual Assembly

  • Quick Costing Techniques and use of Boothroyd Dewhurst Inc Software

  • Design for Automatic Assembly

  • Mechanical Fastening Developments

  • Use of Adhesives in Manufacturing

  • Designing for injection Moulding, die Casting, Press work

  • Product Design for the Environment (Recycling and Remanufacture)

  • Design for Servicing and Maintainability

 

Demos On:
 Design for Manufacturability and Assembly Boothroyd Dewhurst Inc

By:  Prof. M. N. Sudhindra Kumar , Professor, Dept. Of Design, MSRSAS

Start Date: 21st August 2010     End Date: 12th September 2010   

Days & Timings:
Theory Session:
Saturday 2.00 pm - 5.30 pm & Sunday 10.00 am - 2.00 pm  
Laboratory Demos: Sunday 2.30 Pm - 5.30 Pm

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Contact and Fee Details :                                                                        

Course Fee:
Theory :
Rs. 5,000/-
Theory and  Laboratory: Rs. 10,000/-
payable as a single installment.

You can pay the Course Fee by Cash on the course joining day or enroll yourself by sending a Cheque/DD in advance in favour of
M. S. Ramaiah School of Advanced Studies, Bangalore.

Kindly bring two passport/stamp size photos for registration purpose.

For further enquiries or clarifications, please contact

Mr. Vijaykumar S.
Manager - Academic Relations
E-Mail: vijaykumar@msrsas.orgvijay.msrsas@gmail.com
Mobile: 998863 94532

Mrs. Roopa
Executive - Academic Relations
E-Mail: roopa@msrsas.org
Mobile: 96630 63832
Phone: Direct: 4167 4719, (080) 2360 5539, 2360 1983, 2360 4759 Fax: 80 - 2360 1923

Note: If you are unable to attend the course due to time constraints then the same course can be conducted as a corporate training
programme provided the participants strength is 15 or above. So please feel free to contact us for any other information.