Three Day Seminar on
“High Speed Board
Design”
Organized by
M. S. Ramaiah School of Advanced Studies
Date: 10th, 11th & 12th July
2008
( Thursday, Friday & Saturday)
Venue: M. S. Ramaiah
School of Advanced Studies, Bangalore
Overview:
With increasing demand for new electronic products with latest
technologies, engineers need to innovate, design and realize new
applications to meet the rising demand. Integrated circuits working
at very high speed clocks are being designed with latest VLSI
technology, integration of these discrete devices on a PCB should
ensure that the data rate of signals propagating on board (PCB)
matches with the clock speed of the devices on board. Increasing
clock speeds and fast serial interconnections are bringing
high-speed design considerations into mainstream board development.
High-speed signal propagation places particular demands on the
physical design of PCB.
A successful high-speed printed circuit board (PCB) requires
integration of the device(s), PCB(s), and other elements into the
design. Understanding high-speed fundamentals and the relationship
of speed to distance and how to apply this knowledge is the key to
successful designing. Any significant noise problems at the system
level can be very expensive and must be solved at the board level
during layout. But yet board costs must be managed properly. It is
easy to over-design a product, have unnecessary layers and drive the
cost of a product up too high.
Global market for PCB design:
Market Size estimate - $50 Billion worldwide in 2008. CAGR
(compounded Annual growth rate) of greater than 12% as per EE Times
September 2007 issue. India is getting greater number of new PCB
design starts due to a. low manpower costs, b. Ability to deliver
designs of medium complexity within budget and on time< 1 month and
maximum of 1 iteration. PCB-CAD Market is about 10% of the EDA
Software market at about 500-600 million dollars worldwide.
Primarily the market in Asia for PCB design consists for 5 major
application areas: Consumer Electronics 26%, Industrial controls +
Medical Electronics + instrumentation – 22%, Telecom industries –
17%, Automotive – 8%, Computers/Peripherals – 19%, Military + Others
- 8%.
Opportunities:
Most of the high speed PCB design jobs are being outsourced to
India, and at the same time many of the Indian companies venturing
into developing innovative products for the local market and
overseas market, there is a huge demand for high speed board design
engineers. The demand is mainly due to nonavalibality skilled design
engineers those who can take up challenging opportunities. Engineers
with strong fundamental knowledge in issues like signal integrity,
RF, cross talk, layout design are in greater demand if they are well
versed with high speed design and analysis using industry standard
tools.
Seminar Focus:
This three day, lecture/demo course, focuses on fundamental
principles in high speed board design, signal integrity, cross talk,
terminations and reflections, power distribution and layout design.
The emphasis is also towards use of industry standard tools for
design and analysis of high speed board design issues. Extensive use
is made of simulation tools and numerical examples. This is a
practical seminar for the design engineer who must solve circuit
board layout and design problems on a regular basis.
Objectives:
• This practical seminar covers the important issues in high-speed
digital design and signal integrity.
• Dedicated specifically for engineers and designers who have to
work with high-speed digital signals, this course will enable them
to identify and address high-speed design problems.
• Practical sessions using education and EDA software tools will
complete the course.
• Anyone who works with high-speed digital signals will understand
and benefit from the material presented and as well learn how these
techniques could be applied with state-of-the art tools in today's
design flows.
Who should attend?
• Digital logic designers
• System architects
• EMC specialists
• Technicians
• Printed wiring layout professionals
• Applications engineers
• Anyone who works with digital logic at high speeds
This is a practical seminar. It is filled with examples,
explanations, and demonstrations. Anyone who works with high-speed
digital signals will understand and benefit from the material
presented.
Lecture Sessions:
The topics identified are based on the market scenario in the area
of High speed board design. Suggestions from experts in this domain
have recommended the topics and are also delivering the same. Guest
speakers from MNC’s DRDO organizations, Academic institutions with
strong knowledge and experience are being invited to deliver the
sessions and share their experiences.
| Day 1 |
| Date |
Time |
Programme |
Faculty |
| 10th July, 2008 (Thursday) |
| 09.30 AM - 11.00 AM |
Key Note Address |
Experts from M/s Cadence Design Systems India Pvt. Ltd. |
| 11:00 AM – 11:15 AM |
Tea break |
|
| 11.5 AM - 1:15 PM |
High Speed Board Design |
Mr. Raghunath C.R. Scientist G, LRDE |
| 1:15 PM - 2:00 PM |
Lunch Break |
|
| 2:00 PM – 3:30 PM |
Devices and models |
Experts from M/s Wipro Technologies Ltd. |
| 3:30 PM - 3:45 PM |
Tea Break |
|
| 3:45 PM – 5:30 PM |
Transmission Lines |
Experts from M/s Mindtree Ltd. |
| |
|
Day 2 |
| 11th July, 2008 (Friday) |
9:30 AM - 11:00 AM |
Front to Back PCB Design Flow |
Experts from M/s Cadence Design Systems India Pvt. Ltd |
| 11:00 AM – 11:15 AM |
Tea Break |
|
| 11.15 AM - 1:15 PM |
Front to Back PCB Design Demo |
Experts from M/s Cadence Design Systems India Pvt. Ltd. |
| 1:15 PM - 2:00 PM |
Lunch Break |
|
| 2:00 PM – 3:30 PM |
Cross Talk and Signal Integrity |
Experts from M/s Wipro Technologies Ltd. |
| 3:30 PM - 3:45 PM |
Tea Break |
|
| 3:45 PM – 5:30 PM |
Impedance control and Reflections |
Experts from M/s TCS |
|
Day 3 |
| 12th July, 2008 (Saturday) |
9:30 AM - 11:00 AM |
Power Distribution and Terminations |
Experts from M/s E-CAD |
| 11:00 AM – 11:15 AM |
Tea Break |
|
| 11.15 AM - 1:15 PM |
EMI/EMC |
Dr. Pandey, LRDE |
| 1:15 PM - 2:00 PM |
Lunch Break |
|
| 2:00 PM – 3:30 PM |
High Speed Design Flow |
Experts from M/s Cadence Design Systems India Pvt. Ltd |
| 3:30 PM - 3:45 PM |
Tea Break |
|
| 3:45 PM – 5:30 PM |
High Speed Design Flow Demo |
Experts from M/s Cadence Design Systems India Pvt. Ltd. |
Registration Form Download
Please send your registration form to,
Mr. Vijaykumar S.
Manager - Academic Relations
M S Ramaiah School of Advanced Studies
Gnanagangothri Campus, New BEL Road,
M S R Nagar, Bangalore - 560 054, INDIA
E-Mail: vijaykumar@msrsas.org, vijay_msrsas@yahoo.com
Mobile: 98863 94532
Mr. Vinod V.
Sr. Executive - Academic Relations
E-Mail: vinod@msrsas.org
Mobile: 98801 93369
Ph/Fax: 91- 080 - 2360 5539, 2360 1983, 2360 4759
Direct: 4167 4719
Last date for registration - 8th
July 2008(Tuesday)
Note: Outstation participants to send only DD/Cash
Registration Fee:
Rs. 4,000/- For Industrial Participants
Rs. 2,500/- For Faculty from Academic Institutions
Rs. 1,500/- For Students from Academic Institutions
(Inclusive of course material, lunch & tea)
Note: Payments to be made through D.D in favour of : M.S.Ramaiah School of Advanced Studies, Payable at Bangalore.
REGISTRATION FORM
M.S.RAMAIAH SCHOOL OF ADVANCED STUDIES
Gnanagangothri Campus,
New BEL Road, M.S.R Nagar,
Bangalore – 560 054, INDIA.
Telefax: 91-80-2360 5539, 2360 1983, 2360 4759
e-mail : cpd@msrsas.org
Website: www.msrsas.org
Programme :
“High Speed Board Design”
Date :10th - 12th July, 2008 (
Thursday, Friday & Saturday )
Please register the following persons
Name Designation
1)______________________________________________
2)______________________________________________
3)______________________________________________
4)______________________________________________
5)______________________________________________
We enclose Cheque/ DD No:____________ dated_________for Rs._________ drawn in favour of M.S.Ramaiah School of Advanced Studies, Payable at Bangalore.
Nominated By
Name: _________________________________________
Designation: ____________________________________
Organization ____________________________________
Address: _______________________________________
_______________________________________________
_______________________________________________
Phone Nos:_______________________________________
Fax Nos:_________________________________________
E-Mail: __________________________________________
Signature with Seal
Date:
|